Influence of Isocyanate Content and Hot-Pressing Temperatures on the Physical–Mechanical Properties of Particleboard Bonded with a Hybrid Urea–Formaldehyde/Isocyanate Adhesive

Particleboard (PB) is mainly produced using urea–formaldehyde (UF) adhesive. However, the low hydrolytic stability of UF leads to poor water resistance by PB. This research aimed analyze effect hot-pressing temperatures and addition methylene diphenyl diisocyanate (MDI) in adhesive on physical mechanical properties The first experiment focused pressing temperature treatments including 130, 140, 150, 160 °C. particles were bonded a combination MDI resin at ratio 70/30 (%w/w). Furthermore, second UF/MDI treatment, 100/0, 85/15, 70/30, 55/45 (%w/w), pressed 140°C. All single-layer particleboard this 250 × mm, with target thickness density 10 mm 750 kg/m3, respectively. used 12% content based oven-dry weight wood shaving. time pressure determined be min 2.5 N/mm2, Before tests, board was conditioned for 7 days. When studying treatment temperature, good (thickness swelling absorption) (MOR MOE) obtained 140 no significant difference observed between 85/15 same temperature. increase improves MOE MOR values. internal bond contrary. study suggests that °C could produce PB panel meets type 8 according JIS A5908-2003 standard P2 EN 312-2010 standard.